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| Product Specification 108-1973 08Jun07 Rev B Multi-Beam XL* Board Mount Receptacle or Plug Connector System 1. 1.1. SCOPE Content This specification covers performance, tests and quality requirements for the Tyco Electronics MultiBeam XL* Board Mount Receptacle or Plug Connectors. 1.2. Qualification When tests are performed on the subject product line, procedures specified in Figure 3 shall be used. All inspections shall be performed using the applicable inspection plan and product drawing. 1.3. Qualification Test Results Successful qualification testing on the subject product line was completed on 21Dec06. The Qualification Test Report number for this testing is 501-646. This documentation is on file at and available from Engineering Practices and Standards (EPS). 2. APPLICABLE DOCUMENTS The following documents form a part of this specification to the extent specified herein. Unless otherwise specified, the latest edition of the document applies. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1. Tyco Electronics Documents 108-2157-1: Product Specification (Multi-Beam XL Cable Plug) 109 Series: Test Specifications as indicated in Figure 3 109-197: Test Specification (AMP Test Specifications vs EIA and IEC Test Methods) 114-13038: Application Specification (Multi-Beam XL Connectors) 501-597-1: Qualification Test Report (Multi-Beam XL Cable Plug) 501-646: Qualification Test Report (Multi-Beam XL Board Mount Receptacle or Plug Connector System) 2.2. 3. 3.1. REQUIREMENTS Design and Construction Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. (c)2007 Tyco Electronics Corporation Harrisburg, PA All International Rights Reserved. ! ! ! ! ! ! Industry Standard EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications * Trademark | Indicates change For latest revision, visit our website at www.tycoelectronics.com\documents. For Regional Customer Service, visit our website at www.tycoelectronics.com 1 of 7 LOC B 108-1973 3.2. Materials Materials used in the construction of this product shall be as specified on the applicable product drawing. 3.3. Ratings Voltage: See Figure 1 Current: See Figure 2 Temperature: -20 to 105/C Contact Pitch .100 inch [2.54 mm] .200 inch [5.08 mm] .250 inch [6.35 mm] .300 inch [7.62 mm] Within Primary Circuits NR 60 (see Note) 200 300 Primary to Secondary Circuits NR 60 (see Note) NR 150 Primary to Ground Circuits NR 60 (see Note) 200 300 Within Secondary Circuits 60 (see Note) 60 (see Note) 200 300 Contact Type Signal Power Power Power Single Signal Contact 4 3.4. Rev B ! ! ! NOTE Denotes Safety Extra Low Voltage (SELV) circuits. Figure 1 Volts RMS or DC Signal Contacts 24 Adjacent Signal Contacts 1.5 Module (Power Contact Pitch) .300 inch [7.62 mm] .250 inch [6.35 mm] Single Power Contact 55 55 Power Contacts Two Adjacent Power Contacts 50 ----Four Adjacent Power Contacts 47 42 Eight Adjacent Power Contacts ----35 NOTE A test system consists of 8 adjacent power contacts on .250 inch [6.35 mm] contact pitch or 4 adjacent power contacts on a .300 inch [7.62 mm] contact pitch. Connectors are applied to test boards with 2, 4 ounce thick copper power planes. Figure 2 Current Per Contact (amperes) Performance and Test Description Product is designed to meet the electrical, mechanical and environmental performance requirements specified in Figure 3. Unless otherwise specified, all tests shall be performed at ambient environmental conditions per EIA-364. 2 of 7 108-1973 3.5. Test Requirements and Procedures Summary Test Description Initial examination of product. Requirement Meets requirements of product drawing. Procedure EIA-364-18. Visual and dimensional (C of C) inspection per product drawing. Document gold plating thickness at contact interfaces. EIA-364-18. Visual inspection. Final examination of product. Meets visual requirements. ELECTRICAL Low level contact resistance, signal Power contacts: and power contacts. 10 milliohms maximum initial. 20 milliohms maximum final. Signal contacts: 15 milliohms maximum initial. 20 milliohms maximum final. Contact resistance at rated current, 0.7 milliohm maximum, end of life. power contacts. EIA-364-23. Subject specimens to 100 milliamperes maximum and 20 millivolts maximum open circuit voltage. EIA-364-6. 47 amperes for .300 centerline. 35 amperes for .250 centerline. See Figure 2. EIA-364-21. 500 volts DC, 2 minute hold. Test between adjacent contacts of mated specimens. Insulation resistance. 500 megohms minimum for signal contacts. 1000 megohms minimum for power contacts. Withstanding voltage. 1 minute hold with no breakdown or EIA-364-20, Condition I. flashover. 1000 volts DC at sea level for signal contacts. 2500 volts DC for power contacts. Test between adjacent contacts of mated specimens. 30/C maximum temperature rise at specified current. EIA-364-70, Method 1. Stabilize at a single current level until 3 readings at 5 minute intervals are within 1/C. Test with single energized contact and with all adjacent power contacts energized. Temperature rise vs current. MECHANICAL Vibration, random. No discontinuities of 1 microsecond EIA-364-28, Test Condition VII, or longer duration. Condition E. See Note. Subject mated specimens to 4.90 G's rms between 20-500 Hz. Fifteen minutes in each of 3 mutually perpendicular planes. Figure 3 (continued) Rev B 3 of 7 108-1973 Test Description Mechanical shock. Requirement Procedure No discontinuities of 1 microsecond EIA-364-27, Method A. or longer duration. Subject mated specimens to 50 G's See Note. half-sine shock pulses of 11 milliseconds duration. Three shocks in each direction applied along 3 mutually perpendicular planes, 18 total shocks. See Note. EIA-364-9. Mate and unmate specimens for 250 cycles at a maximum rate of 500 cycles per hour. EIA-364-13. Measure force necessary to mate specimens at a maximum rate of 12.7 mm [.5 in] per minute. EIA-364-13. Measure force necessary to unmate specimens at a maximum rate of 12.7 mm [.5 in] per minute. AMP Spec. 109-41. Measure force necessary to correctly apply a specimen to a printed circuit board at a maximum rate of 12.7 mm [.5 in] per minute. AMP Spec. 109-136. Measure at 0.2 to 0.5 mm [.008 to .020 in] depth. AMP Spec 109-30-1. Measure force necessary to remove a correctly applied specimen from its printed circuit board at a maximum rate of 12.7 mm [.5 in] per minute. AMP Spec. 109-202, Condition B. AMP Spec. 109-11-11, Test Method A. Durability. | | Mating force. 9 N [2 lbf] maximum for power contact. Average mating force for signal contacts shall be less than 1.7 N [6 ozf] per contact. 2.2 N [8 ozf] minimum per power contact. 0.2 N [.7 ozf] minimum per signal contact. 111.2 N [25 lbf] maximum per pin. Unmating force. Compliant pin insertion. Radial hole distortion. 0.070 mm [.00276 in] maximum radial distortion. 0.008 mm [.00032 in] minimum copper hole wall remaining. 6.7 N [1.5 lbf] minimum per pin. Compliant pin retention. Component heat resistance to wave soldering. Solderability dip test. See Note. Solderable area shall have a minimum of 95% solder coverage. See Note. ENVIRONMENTAL Thermal shock. See Note. EIA-364-32. Subject mated specimens to 36 cycles between -20 and 105/C. Figure 3 (continued) Rev B 4 of 7 108-1973 Test Description Humidity-temperature cycling. See Note. Requirement Procedure EIA-364-31, Method III. Subject mated specimens to 10 cycles (10 days) between 25 and 40/C at 80 to 100% RH. EIA-364-17, Method A, Test Condition 4. Subject mated specimens to 105/C for 504 hours (21 days). EIA-364-65, Class IIA. Subject mated specimens to environmental Class IIA for 14 days. Temperature life. See Note. Mixed flowing gas. See Note. NOTE Shall meet visual requirements, show no physical damage, and meet requirements of additional tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure 4. Figure 3 (end) Rev B 5 of 7 108-1973 3.6. Product Qualification and Requalification Test Sequence Test Group (a) Test or Examination Initial examination of product Low level contact resistance, signal and power contacts Low level contact resistance, power contacts only Contact resistance at rated current, power contacts Insulation resistance Withstanding voltage Temperature rise vs current Vibration, random Mechanical shock Durability Mating force Unmating force Compliant pin insertion Radial hole distortion Compliant pin retention Component heat resistance to wave soldering Solderability dip test Thermal shock Humidity-temperature cycling Temperature life Mixed flowing gas Final examination of product 4 6 9 8 5 4 5 3 7 5 13 4 5 2 3 3(e) 5 6 4 2(g) 8(g) 2 3 4 3(f) 2,6 3,7 4,11 9(d) 1 1 2,5 2 1 3,7 3 1 4 1 2,4 2,6,8,10 12 5 1 6(b) 7(b) 1 1 Test Sequence (c) NOTE (a) (b) (c) (d) (e) (f) (g) See paragraph 4.1.A. Split into subgroups as needed for on and off board tests. Numbers indicate sequence in which tests are performed. Energize at current for 18/C temperature rise. Precondition specimens with 5 durability cycles. Precondition specimens with 50 durability cycles. Power only in housing, signal with gage as shown in 108-2157. Figure 4 Rev B 6 of 7 108-1973 4. 4.1. QUALITY ASSURANCE PROVISIONS Qualification Testing A. Specimen Selection Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. Test Groups 1 and 4 were carried over from the qualification results of the MBXL Cable Plug program (see Qualification Test Report 501-597-1) since the contact interface is identical to the vertical header. Test Group 2 shall consist of 15 vertical headers with soldertails mated to right angle receptacles with soldertails. Five of these headers shall be fully loaded with power and signal contacts, 5 with power contacts only, and 5 with signal contacts only. Test Group 3 shall consist of 3 vertical headers with soldertails mated to 3 right angle receptacles with soldertails. Test Group 5 shall consist of 5 vertical headers with soldertails mated to 5 right angle receptacles with soldertails. Test Group 6 shall consist of 5 vertical headers with soldertails. Test Group 7 shall consist of 8 vertical headers with press-fit, Eye-of-the-Needle tails. B. Test Sequence Qualification inspection shall be verified by testing specimens as specified in Figure 4. 4.2. Requalification Testing If changes significantly affecting form, fit or function are made to the product or manufacturing process, product assurance shall coordinate requalification testing, consisting of all or part of the original testing sequence as determined by development/product, quality and reliability engineering. 4.3. Acceptance Acceptance is based on verification that the product meets the requirements of Figure 3. Failures attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to confirm corrective action is required before resubmittal. 4.4. Quality Conformance Inspection The applicable quality inspection plan shall specify the sampling acceptable quality level to be used. Dimensional and functional requirements shall be in accordance with the applicable product drawing and this specification. Rev B 7 of 7 |
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